Textbook in PDF format Build the microchips of the future with this revolutionary new information transfer technology. Advancements in high-performance computing have continually demanded for progress in disruptive technological research and innovations. Moore’s Law has pushed the Very Large Scale Integration (VLSI) technology to pack MOS devices inside a chip at an exponential rate, thereby surpassing now eight billion transistors per cm2. This has concomitantly fueled the growth of multilayered on-chip interconnects comprising metallic and low dielectric materials. Artificial Plasmonics for VLSI Interconnects introduces a new method for improving chip performance by harnessing the power of information transfer among chips at terahertz frequency. This revolutionary new electromagnetic wave engineering, called a spoof surface plasmon polariton, adapts the principles of VLSI and terahertz interconnect technology along with the artificial plasmonics to transfer huge quantities of data at vastly improved speeds. It constitutes a potentially decisive contribution to the pursuit of faster and more capacious VLSI chips. At the heart of modern computing are transistors and interconnects. For decades, transistor miniaturization fueled performance scaling. However, as transistor limits become apparent, the focus has shifted to interconnects, now crucial to integrating multiple dies/chiplets and extending computational performance in advanced VLSI design. Despite their newfound prominence, interconnects face a paradox: unlike transistors, their performance degrades with downscaling. Reduced wire cross sections increase resistance, and higher density in advanced nodes elevates capacitance. These challenges worsen signal integrity, limit the bandwidth, and contribute significantly to power dissipation, bottlenecking terabit-per-second data transfer. Existing solutions offer only incremental improvements, leaving the core problem unresolved. In Artificial Plasmonics for VLSI Interconnects, readers will also find: A cutting-edge new approach supported by pioneering research Detailed discussion of essential components related to the development of THz interconnect technology, including theory, modeling, simulation, and validation Roadmap to future technological development in the branch of artificial plasmonics Artificial Plasmonics for VLSI Interconnects is ideal for engineers, researchers, and scientists working in electronics, electromagnetics, and optics. For graduate students and researchers specializing in VLSI design, the inherent challenges of interconnects are acutely recognized. While optical interconnects offer compelling advantages for long-distance data transmission, and electrical interconnects suffice for micron-scale distance, limited by their RC delay and parasitic coupling, a critical technological gap persists for centimeter-scale communication, particularly concerning terascale data transfer among electronic chiplets. This book attempts to address this significant gap by introducing an emergent technology: the spoof surface plasmon polariton (SSPP) waveguide. Preface Prospects and Pitfalls of Modern Interconnect Technologies Spoof Plasmonics: Origin and State-of-the-Art Development Fundamental Electrodynamics of Spoof Plasmonic Mode Information Capacity of Spoof Plasmonic Interconnect Augmented Bandwidth by Spoof Plasmonics Signal Modulation by Spoof Plasmonics Process Variation Effect on Spoof Plasmonic Interconnect: Compensations Future Research Avenues for Spoof Plasmonic Interconnects